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Characterization of masking layers for deep wet etching of glass in an improved HF/HCl solution

2004; Elsevier BV; Volume: 198; Issue: 1-3 Linguagem: Inglês

10.1016/j.surfcoat.2004.10.094

1879-3347

Ciprian Iliescu, Jing Ji, Francis E. H. Tay, Jianmin Miao, Tietun Sun,

Thin-Film Transistor Technologies

The paper presents a solution for improving the quality of the surface generated during deep wet etching of glass using an HF (49%)/HCl (37%) solution in a volumetric ratio 10:1. Pyrex glass (Corning 7740) and soda lime glass were analyzed. In addition, the characterization of the main masking layers, including photoresist, amorphous silicon, polysilicon and Cr/Au for deep wet etching in the optimal solution, is described.