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Analysis of a passive heat sink for temperature stabilization of high-power LED bulbs

2015; IOP Publishing; Volume: 605; Linguagem: Inglês

10.1088/1742-6596/605/1/012005

1742-6596

Eduardo Balvís, Ricardo Bendaña, Humberto Michinel, Pedro Fernández de Córdoba, Ángel Paredes,

Thin-Film Transistor Technologies

In this paper we present a numerical analysis and experimental measurements of the temperature stabilization of high-power LED chips that we have obtained by employing an aluminum passive heat sink, designed to be used in a compact light bulb configuration. We demonstrate that our system keeps the temperature of the LED chip well-below 70° C yielding long-term operation of the device. Our simulations have been performed for a low-cost device ready to install in public streetlights. The experimental measurements performed in different configurations show a nice agreement with the numerical calculations.