Microstructure and superconducting properties of niobium and tantalum films sputtered onto copper substrates
1977; Wiley; Volume: 42; Issue: 2 Linguagem: Inglês
10.1002/pssa.2210420223
ISSN1521-396X
Autores Tópico(s)Particle accelerators and beam dynamics
Resumophysica status solidi (a)Volume 42, Issue 2 p. 595-607 Original Paper Microstructure and superconducting properties of niobium and tantalum films sputtered onto copper substrates M. J. Witcomb, M. J. Witcomb Electron Microscope Unit, University of the Witwatersrand, JohannesburgSearch for more papers by this author M. J. Witcomb, M. J. Witcomb Electron Microscope Unit, University of the Witwatersrand, JohannesburgSearch for more papers by this author First published: 16 August 1977 https://doi.org/10.1002/pssa.2210420223Citations: 8AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onEmailFacebookTwitterLinkedInRedditWechat Abstracten Niobium and tantalum films argon-sputtered onto deoxidized copper are found to yield superconducting parameters close to the bulk pure material only when the substrate is in-situ heated to about 1300 K for 0.5 h prior to film deposition. Flux penetration is then found to be fairly homogeneous and relatively unaffected for films 5 to 10 μm thick by surface topography generated by copper evaporation. The results of studies by both transmission and scanning electron microscopy of film structure and adhesion to substrate are reported. Abstractde Des films de niobium et de tantalum envoyés en postillons en atmosphère d'argon sur du cuivre desoxydisé ont montré exhibé des parametrès de superconductivité proches de ceux du materiel pur en vrac à condition que le substrat ait été chauffé in situ jusqu'à environ 1300 K pour une periode de 0,5 h avant le déposition du film. 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