Room-temperature formation of tantalum oxide films by liquid phase deposition
2004; Elsevier BV; Volume: 478; Issue: 1-2 Linguagem: Inglês
10.1016/j.tsf.2004.11.100
ISSN1879-2731
Autores Tópico(s)Copper Interconnects and Reliability
ResumoThis paper demonstrates the growth of tantalum pentoxide (Ta2O5) on a silicon (Si) substrate at room temperature (∼10 °C) by means of a liquid phase deposition (LPD) method. Good quality and reliability is obtained due to the low temperature process. The deposition rate is up to 136.5 nm/h and the refractive index of the LPD-Ta2O5/Si is about 1.86 after annealing at 400 °C. The LPD-Ta2O5 film produced on the Si substrate is used to fabricate a metal–oxide–semiconductor (MOS) capacitor with a device area of 0.3 cm2, giving a surface charge density of about 1.6×1011 cm−2 and a breakdown voltage of 6.5 MV/cm. Also presented is a proposed mechanism for the LPD deposition of Ta2O5 on Si.
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