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High‐definition displays and technology trends in TFT‐LCDs

1994; Wiley; Volume: 2; Issue: 1 Linguagem: Inglês

10.1889/1.1984902

1938-3657

I‐Wei Wu,

3D IC and TSV technologies

Abstract— The current status of flat‐panel‐display (FPD) technologies is outlined, with emphasis on liquid‐crystal displays (LCDs). Recently announced high‐density LCDs, their structures, and their underlying technologies are summarized and compared. Technology trends in thin‐film‐transistor (TFT) LCDs are discussed. Advancements in a‐Si TFT technology are reviewed; in particular, the geometry, structure, and materials of TFTs, gate bus‐line metallization, storage capacitors, self‐aligned doping methods, viewing angle, aperture ratio, and power consumption are discussed. Emerging poly‐Si TFT‐LCD technology is presented. Its advantages in integrating peripheral driver circuits, improving pixel density, and image quality as compared to the a‐Si TFT counterparts are reported. Projection high‐definition liquid‐crystal modules fabricated by using a‐Si and poly‐Si TFTs are compared. Scaling up of the substrate size and scaling down TFT geometry are the two main directions for the poly‐Si TFT; this should enable large‐size high‐definition direct‐view panel fabrication and will enhance the image quality of these displays.