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Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints

2006; Elsevier BV; Volume: 55; Issue: 11 Linguagem: Inglês

10.1016/j.scriptamat.2006.08.024

1872-8456

T CHUANG,

3D IC and TSV technologies

In spite of the many beneficial effects obtained from the addition of rare earth elements to solder alloys, rapid growth of tin-whiskers has been found in Sn–3Ag–0.5Cu–1.0Ce solder joints. The morphology of the whiskers changes from fiber-shaped to hillock-shaped when the storage temperature increases from 25 to 150 °C. The driving force for the whisker growth is the compressive stress resulting from the volume expansion of the oxidized CeSn3 phase, which is constrained by the surrounding solder matrix.