Microstructural characterization and computer simulation of conductivity in Si3N4–TiN composites
2004; Elsevier BV; Volume: 373; Issue: 1-2 Linguagem: Inglês
10.1016/j.jallcom.2003.10.036
ISSN1873-4669
AutoresLj. Živković, Zoran S. Nikolić, S. Bošković, Milena Miljković,
Tópico(s)Thermal properties of materials
ResumoSi3N4–TiN ceramics sintered with Y2O3 and Y2O3+Al2O3 as sintering aids and various content of TiN (0–50 wt.%) were investigated regarding their microstructural and electrical properties. Electroconductive composites were obtained with TiN content higher than 20 vol.%. Computer simulation of conductivity versus concentration of TiN has been done in respect of different models. The influence of dimensionality and type of conductive network on the critical exponent s in the power law, which describes the conductivity of composites, has been discussed. The addition of β-Si3N4 seeds affected fracture toughness in Si3N4–36 wt.% TiN composites while only a slight change in electroconductivity of the composites was observed at the same time.
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