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Self-aligned flip-chip packaging of tilted semiconductor optical amplifier arrays on Si motherboard

1995; Institution of Engineering and Technology; Volume: 31; Issue: 6 Linguagem: Inglês

10.1049/el

1350-911X

Walter Hunziker, W. Vogt, H. Melchior, D. Leclerc, P. Brosson, F. Pommereau, R. Ngo, P. Doussière, F. Mallécot, T. Fillion, I. Wamsler, G. Laube,

Semiconductor Quantum Structures and Devices

An optical self-aligned flip-chip packaging technique for tilted semiconductor optical amplifier arrays is reported. It uses a Si motherboard with V-grooves for self-alignment between the tilted SOA array and angle polished fibre arrays. Fibre-to-fibre gain of 14 ± 1 dB and ripple ±0.1 dB without antireflection coating on the fibres have been achieved.