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High-temperature oxidation of nickel-plated copper vs pure copper

1999; Taylor & Francis; Volume: 38; Issue: 4 Linguagem: Francês

10.1016/s0008-4433(99)00021-x

1879-1395

Uchechukwu Victor Aniekwe,

Advanced ceramic materials synthesis

Thin layers of nickel were plated onto copper to improve oxidation resistance at high temperatures. Pure copper and nickel-plated copper were oxidized at 600–800°C in air for various lengths of time. The degree of oxidation was determined by the mass gain. It was found that the nickel-plated copper oxidizes at a rate of about 1/20 of that of pure copper. The oxidation rate of both the pure copper as well as the nickel-plated copper was approximately parabolic in the temperature range studied. The thicknesses of the oxidized layers for copper and nickel-plated copper are given by the following two equations, respectivelyCu: t(mm) = 50,000 × √exp (−1.97 −18,000/t(K)×√YearsNi plated Cu: t(mm) = 23,000 × √ exp −7.3 − 17,300/t(K) × √Years© 2000 Canadian Institute of Mining and Metallurgy. Published by Elsevier Science Ltd. All rights reserved. Résumé On a plaqué des couches minces de nickel sur du cuivre pour améliorer la résistance à l'oxydation à haute temperature. On a oxydé du cuivre pur et du cuivre plaqué au nickel, de 600 à 800° C, à l'air, pour des périodes variées. On a déterminé le degré d'oxydation par le gain de masse. On a trouvé que le cuivre plaqué au nickel s'oxydait à un taux d'environ 1/20 de celui du cuivre pur. Le taux 'oxydation du cuivre pur, autant que du cuivre plaqué au nickel, Hait approximativement parabolique dans l'intervalle de température étudié. L'épaisseur des couches oxydees pour le cuivre et pour le cuivre plaque au nickel est donnee par les deux équations qui suivent, respectivement:Cu: t(mm) = 50,000 × √exp (−1.97 −18,000/t(K)×√YearsNi plated Cu: t(mm) = 23,000 × √ exp −7.3 − 17,300/t(K) × √Years© 2000 Canadian Institute of Mining and Metallurgy. Published by Elsevier Science Ltd. All rights reserved.