Portal de Periódicos da CAPES

Plasma Process. Polym. 6/2010

2010; Wiley; Volume: 7; Issue: 6 Linguagem: Inglês

10.1002/ppap.201090010

1612-8869

Stefano Costacurta, Luca Malfatti, Alessandro Patelli, Paolo Falcaro, Heinz Amenitsch, Benedetta Marmiroli, Gianluca Grenci, M. Piccinini, Plinio Innocenzi,

Copper Interconnects and Reliability

Front Cover: Silica thick films deposited by PECVD have been patterned using deep X-ray lithography in a process allowing fast writing of the films. This patterning technique is based on the selective removal of the organic species induced by X-rays and local densification of the exposed regions. Further details can be found in the article by S. Costacurta, L. Malfatti, A. Patelli, P. Falcaro, H. Amenitsch, B. Marmiroli, G. Grenci, M. Piccinini, and P. Innocenzi* on page 459.