Parallel assembly of microsystems using Si micro electro mechanical systems
2003; Elsevier BV; Volume: 67-68; Linguagem: Inglês
10.1016/s0167-9317(03)00100-x
ISSN1873-5568
AutoresGeorge D. Skidmore, M. Ellis, A. Geisberger, K. Tsui, Rahul Saini, Trent Huang, John N. Randall,
Tópico(s)Advanced Surface Polishing Techniques
ResumoThe remarkable advances in miniaturization have been achieved largely by the monolithic integration techniques developed by the integrated circuit industry. However, monolithic integration frequently results in compromised performance and for complete systems frequently there is "some assembly required". Assembly is typically an expensive procedure that is carried out serially either by human hands or by automated machinery. However, with the growing demand for microsystems, there is an opportunity to drastically reduce assembly costs by arraying both the parts and microsystems, so that parallel assembly can be used. This paper describes an approach to parallel assembly that makes use of silicon micro electro mechanical systems that should achieve low assembly costs while maintaining high precision and a clear path to downscaling.
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