Synthesis and characterization of high temperature stable epoxy adhesive
2008; Ceramic Society of Japan; Volume: 116; Issue: 1352 Linguagem: Inglês
10.2109/jcersj2.116.550
ISSN1882-0743
AutoresSoon‐Gil Yoon, E. S. Kim, Nianjun Kang, Wan-Sun Lee, Yeongun Kim,
Tópico(s)Photopolymerization techniques and applications
ResumoFor the integration of multi-chip module required thermally stable epoxy adhesive, the effects of clay incorporation on the thermal stability of cured epoxy adhesive were investigated. Various epoxy adhesives were prepared as a function of a number of epoxy rings and the amount of hardener. Based on the relationship between the glass transition temperature (Tg) and cross-linking density obtained from the curing mechanism analyzed by FT-IR, the epoxy adhesive with Tg higher than 200°C was synthesized by raising cross-linking density to the maximum. With the incorporation of clay, the curing reaction rate and the degradation of epoxy adhesive can be controlled. The epoxy/clay composite showed the higher height of tanδ peak than that of pure epoxy adhesive.
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