Microstructural evolution of ɛ-AgZn3 and η-Zn phases in Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga solder during aging treatment
2008; Elsevier BV; Volume: 469; Issue: 1-2 Linguagem: Inglês
10.1016/j.jallcom.2008.01.121
ISSN1873-4669
AutoresTeng-Chun Hsuan, Kwang‐Lung Lin,
Tópico(s)3D IC and TSV technologies
ResumoThis study investigated the microstructural evolution of ɛ-AgZn3 and η-Zn phases in Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga solder (5-e alloy) during isothermal aging treatment at 150 °C. Zn element easily precipitates on the surface of AgZn3 intermetallic compounds (IMCs) and grows rapidly during aging. During aging, Ag dissolves in the precipitated Zn which forms the Zn-rich phase (η-Zn), the combination of ɛ-AgZn3 with precipitated Zn-rich became a diffusion couple. The ɛ-AgZn3 compound shrinks apparently upon heat exposure. Furthermore, at the interface of this diffusion couple, it seems to exit a phase transition between ɛ-AgZn3 IMC and η-Zn phase. This phase transition mechanism will be discussed in this paper.
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