Artigo
Breakdown of Bond Length-Bond Strength Correlation: A Case Study This work was supported by Deutsche Forschungsgemeinschaft and by Fonds der Chemischen Industrie.
2000; National Institutes of Health; Volume: 39; Issue: 24 Linguagem: Inglês
Autores
Martin Kaupp, Bernhard Metz, Hermann Stoll,
Tópico(s)Integrated Circuits and Semiconductor Failure Analysis
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