Artigo Revisado por pares

Theoretical Considerations on the Thermal Expansion of Copper‐Invar‐Copper Metalcore Boards for Surface Mounting Technology

1987; Emerald Publishing Limited; Volume: 13; Issue: 4 Linguagem: Inglês

10.1108/eb043888

ISSN

1758-602X

Autores

K. N. Ritz,

Tópico(s)

Advanced Antenna and Metasurface Technologies

Resumo

A model for a symmetric three‐layer configuration is developed. This model refers to Cu/Invar/Cu (CIC) laminates. Calculated values for the coefficient of thermal expansion (CTE) are compared with literature values. The model is then extended to symmetric CIC‐Metalcore boards and its prediction is compared with experimental results. Shearing of FR‐4 is discussed.

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