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Liquid immersion lithography: evaluation of resist issues

2004; SPIE; Volume: 5376; Linguagem: Inglês

10.1117/12.536576

1996-756X

William D. Hinsberg, Gregory M. Wallraff, Carl E. Larson, Blake Davis, V. R. Deline, Simone Raoux, Dolores C. Miller, Frances A. Houle, John A. Hoffnagle, Martha I. Sanchez, Charles Rettner, Linda K. Sundberg, David R. Medeiros, Ralph R. Dammel, Willard E. Conley,

Advanced Surface Polishing Techniques

We address in this report a set of key questions tied to the implementation of liquid immersion lithography, from the perspective of the resist materials. We discuss the broad question of whether chemically amplified resists are capable of achieving the spatial resolution that ultimately will be required for the most advanced immersion scenario. Initial studies undertaken using model 193 nm resist materials provide some insight into how an aqueous liquid immersion process can affect the resist material.