Thermal Fatigue Life Prediction of Gull-Wing Solder Joints in Plastic Thin Small Outline Packages
1996; Institute of Physics; Volume: 35; Issue: 11B Linguagem: Inglês
10.1143/jjap.35.l1515
ISSN1347-4065
AutoresSeong-Min Lee Seong-Min Lee, Kwon-Woo Lee Kwon-Woo Lee,
Tópico(s)Probabilistic and Robust Engineering Design
ResumoA nonlinear, time-dependent finite element modeling analysis has been performed to determine the strain distribution in gull-wing solder joints and to predict the fatigue life of the plastic thin small outline package (TSOP). The life prediction was done based on the modified Coffin-Manson law where the fatigue life of solder joints subjected to thermal cycling was estimated as a function of the creep strain. Strain-based solder life prediction was first performed to assess the effect of lead material selection, indicating that a ductile lead considerably enhances solder fatigue life. Moreover, numerical calculation also demonstrates how matching the coefficient of thermal expansion of the plastic component and the printed circuit board (PCB) to the reduction of the chip thickness, influences solder joint reliability.
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