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Degradation characteristics of connector contact systems with gold/tin and gold/silver interfaces

1984; Wiley; Volume: 67; Issue: 1 Linguagem: Inglês

10.1002/ecja.4400670113

8756-6621

Yukio Ando, Tsuneo Kanai, Yoshikazu Sakai,

Semiconductor materials and interfaces

Abstract Environmental test results are presented for connector contacts with dissimilar metal interfaces where gold‐plated contacts are matched with silver‐ or tin‐plated contacts. Tested card edge connectors were exposed in 20‐ppm SO 2 atmosphere with three humidity levels and in three field sites during 4.5 years. the results demonstrate that dissimilar metal contact systems show remarkable increase in contact resistance rather than similar base metal contact systems. Particularly, high humidity exposures will cause degradation of such dissimilar systems. the degradation is induced by the galvanic corrosion of wear debris: connector engagement cycles produce the wear debris of substrate metals under the plating. Even in a contact of such similar metals as gold plating, one factor in the degradation is the galvanic corrosion by the wear debris of substrate metals.