A quantitative evaluation of time-independent and time-dependent deformations of lead-free and lead-containing solder alloys
2006; Springer Science+Business Media; Volume: 35; Issue: 1 Linguagem: Inglês
10.1007/s11664-006-0195-9
ISSN1543-186X
AutoresKen-ichi OHGUCHI, Katsuhiko SASAKI, Masahiro Ishibashi,
Tópico(s)High Temperature Alloys and Creep
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