The right way to assess electronic system reliability: FIDES
2003; Elsevier BV; Volume: 43; Issue: 9-11 Linguagem: Inglês
10.1016/s0026-2714(03)00250-6
ISSN1872-941X
AutoresP. Charpenel, Franck Davenel, R. Digout, Michel Giraudeau, Mathieu Glade, JP. Guerveno, Nicolas Guillet, A. Lauriac, S. Male, David Manteigas, Reinhard Meister, Éric Moreau, D. Perie, F. Relmy-Madinska, P. Retailleau,
Tópico(s)Semiconductor materials and devices
ResumoIn this chapter, we address the physics of failure of some critical electronic components in modern industrial systems and assess their effects on system’s reliability. A new methodology combining “conventional” reliability analysis (based on reliability handbook) and physics of failure analysis (using improved accelerated life testing) is illustrated for overall reliability and lifetime analysis in components and system level. Some examples of how such analysis could be used by industries to optimize a design or to select optimal components maximizing system’s reliability will be illustrated. Furthermore, the new trends to improve reliability analysis, such as, online mission profile measurements, online condition monitoring will be discussed.
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