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Small pixel uncooled imaging FPAs and applications

2010; SPIE; Volume: 7660; Linguagem: Inglês

10.1117/12.852970

1996-756X

Richard J. Blackwell, Glen Franks, Daniel Lacroix, Sandra Hyland, Robert Murphy,

CCD and CMOS Imaging Sensors

BAE Systems continues to make dramatic progress in uncooled microbolometer sensors and applications. This paper will review the latest advancements in microbolometer technology at BAE Systems, including the development status of 17 micrometer pixel pitch detectors and imaging modules which are entering production and will be finding their way into BAE Systems products and applications. Benefits include increased die per wafer and potential benefits to SWAP for many applications. Applications include thermal weapons sights, thermal imaging modules for remote weapon stations, vehicle situational awareness sensors and mast/pole mounted sensors.