Plasma processes under vacuum conditions
1990; Elsevier BV; Volume: 41; Issue: 7-9 Linguagem: Inglês
10.1016/0042-207x(90)94144-f
ISSN1879-2715
AutoresA. Bubenzer, Johannes Schmitt,
Tópico(s)Advanced Surface Polishing Techniques
ResumoIn the first part the basics of low pressure plasma processes are briefly reviewed considering excitations by gas phase collisions and electrical potential near surfaces in contact with the plasma (sheat formation). In the second part we discuss the special situation given by the combination of vacuum technology and low pressure plasma technology. The impact of plasma technology on pumps and vacuum vessels is discussed taking into account in particular degassing, impurity situation in the gas phase and gas flow. This is done with a special emphasis on large area industrial machines. In the third part we present a new type of design for a machine for plasma enhanced CVD. This so-called plasma box type reactor is a good example for vacuum technology adapted to a plasma process. The plasma box reactor is designed for large area industrial applications, ensures high thin film uniformity and a uhv-type gas phase purity. The plasma box reactor was tested by deposition of amorphous silicon (a-Si) (for solar cells or thin film transistors), first results of these a-Si depositions are presented.
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