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Complete methodology for electrical modeling of RFIC packages

2001; Institute of Electrical and Electronics Engineers; Volume: 24; Issue: 2 Linguagem: Inglês

10.1109/6040.982842

1557-9980

Tzyy‐Sheng Horng, Sung-Mao Wu, Chih‐Cheng Shih,

3D IC and TSV technologies

A complete methodology based on broadband S-parameter measurement is proposed to establish the electrical models for radio-frequency integrated circuit (RFIC) packages. The research is focused on calibration of the test-fixture parasitics to obtain the intrinsic S-parameters from which an equivalent coupled lumped model can be extracted for any pair of package leads under test. Then a step-by-step optimization scheme is employed to construct an equivalent circuit for the whole package. A real example on modeling a 16-lead Thin Shrink Small Outline Package (TSSOP) has been demonstrated. The established model can account for various package effects at radio frequencies.