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Optimal conditions for the wetting balance test

2008; Elsevier BV; Volume: 209; Issue: 6 Linguagem: Inglês

10.1016/j.jmatprotec.2008.07.015

1873-4774

K.M. Martorano, Marcelo Aquino Martorano, Sérgio Duarte Brandi,

Aluminum Alloy Microstructure Properties

Wetting balance tests of copper sheets submerged in tin solder baths were carried out in a completely automatic wetting balance. Wetting curves were examined for three different values of sheet thickness and four different solder bath temperatures. Most of the wetting curves showed a distorted shape relative to that of a standard curve, preventing calculation of important wetting parameters, such as the wetting rate and the wetting force. The wetting tests showed that the distortion increased for a thicker sheet thickness and a lower solder bath temperature, being the result of solder bath solidification around the submerged sheet substrate.