Wavelength Division Multiplexing Based Photonic Integrated Circuits on Silicon-on-Insulator Platform
2009; IEEE Photonics Society; Volume: 16; Issue: 1 Linguagem: Inglês
10.1109/jstqe.2009.2033454
ISSN1558-4542
AutoresAnsheng Liu, Ling Liao, Yoel Chetrit, Juthika Basak, Hang Tuan Nguyen, Doron Rubin, Mario Paniccia,
Tópico(s)Advanced Photonic Communication Systems
ResumoWe review recent advances in the development of silicon photonic integrated circuits for high-speed and high-capacity interconnect applications. We present detailed design, fabrication, and characterization of a silicon integrated chip based on wavelength division multiplexing. In such a chip, an array of eight high-speed silicon optical modulators is monolithically integrated with a silicon-based demultiplexer and a multiplexer. We demonstrate that each optical channel operates at 25 Gb/s. Our measurements suggest the integrated chip is capable of transmitting data at an aggregate rate of 200 Gb/s. This represents a key milestone on the way for fabricating terabit per second transceiver chips to meet the demand of future terascale computing.
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