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The formation and growth of intermetallic compounds in Sn-Zn and Sn-Zn-Al solder with Ni/Au surface finish bond pad

2006; Springer Science+Business Media; Volume: 35; Issue: 3 Linguagem: Inglês

10.1007/bf02690525

ISSN

1543-186X

Autores

Shih-Chang Chang, Sheng‐Chih Lin, Ker‐Chang Hsieh,

Tópico(s)

Advanced Welding Techniques Analysis

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Journal of Electronic Materials
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