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Overview of packaging for the IBM Enterprise System/9000 based on the glass-ceramic copper/thin film thermal conduction module

1992; Institute of Electrical and Electronics Engineers; Volume: 15; Issue: 4 Linguagem: Inglês

10.1109/33.159869

1558-3082

Rao Tummala, S. Reaz Ahmed,

Electrical and Thermal Properties of Materials

The ES/9000 models 820 and 900 high-performance mainframe processors have been significantly enhanced with respect to their predecessors, due to the following packaging advances: multilayer glass-ceramic/copper cofired substrate; multilayer polyimide/copper thin-film structure; discrete decoupling capacitors; buried engineering change conductors; enhanced pistons for very high thermal conduction cooling; and enhanced flip-chip solder connections. Some aspects of these advances are examined. The connectors and printed wiring board technologies used in this family of systems are summarized. >