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Fabrication of Microstripline Wiring for Large Format Transition Edge Sensor Arrays

2012; Springer Science+Business Media; Volume: 167; Issue: 3-4 Linguagem: Inglês

10.1007/s10909-012-0552-4

1573-7357

J. A. Chervenak, J. M. Adams, C. N. Bailey, S. R. Bandler, Regis P. Brekosky, Megan E. Eckart, A. E. Ewin, F. M. Finkbeiner, Richard L. Kelley, C. A. Kilbourne, F. S. Porter, J. E. Sadlier, S. J. Smith,

Microwave Engineering and Waveguides

We have developed a process to integrate microstripline wiring with transition edge sensors (TES). The process includes additional layers for metal-etch stop and dielectric adhesion to enable recovery of parameters achieved in non-microstrip pixel designs. We report on device parameters in close-packed TES arrays achieved with the microstrip process including R n , G, and T c uniformity. Further, we investigate limits of this method of producing high-density, microstrip wiring including critical current to determine the ultimate scalability of TES arrays with two layers of wiring.