Multi-electrode CZT detector packaging using polymer flip chip bonding
2001; Elsevier BV; Volume: 458; Issue: 1-2 Linguagem: Inglês
10.1016/s0168-9002(00)00912-8
ISSN1872-9576
AutoresValentin T. Jordanov, J. Macri, James E. Clayton, K. Larson,
Tópico(s)Semiconductor Quantum Structures and Devices
ResumoPolymer flip chip bonding has been used to package a multi-electrode CZT detector. During the packaging process the temperature of all components was kept less than 80°C. The size of the conductive epoxy eontacts is less than 120 μm in diameter. Thermal cycling, and random and structural vibration tests indicate reliable detector–substrate interconnection and rugged construction.
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