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Prediction of paddle shift via 3-D TSOP modeling

2000; Institute of Electrical and Electronics Engineers; Volume: 23; Issue: 4 Linguagem: Inglês

10.1109/6144.888854

1557-9972

Durn‐Yuan Huang, Huei‐Huang Lee, Sheng‐Jye Hwang, Fengmin Su,

3D IC and TSV technologies

This study develops a methodology to simulate the molding process of thin small outline packages (TSOPs) and to predict the paddle shift caused by pressure difference and viscous stress during molding through the help of a true three-dimensional (3-D) Computational Fluid Dynamics (CFD) software.