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Three-dimensional memory module

1998; Institute of Electrical and Electronics Engineers; Volume: 21; Issue: 1 Linguagem: Inglês

10.1109/96.659501

1558-3686

Nobuaki Takahashi, N. Senba, Yuzo Shimada, I. Morisaki, K. Tokuno,

3D IC and TSV technologies

Demand has recently increased for high packaging density and memory capacity of memory modules for electronic equipment. The new three-dimensional memory module satisfies this demand. This module has almost the same size as single memory packages [thin small outline packages (TSOPs): 17.4/spl times/9.22/spl times/1.2 mm] currently being used, and a package density four times as large. Electrical performance is better than that of TSOP's because the length of the wires is about half that of the TSOP's wires. Moreover, the cost of fabrication of this module is low. This paper reports the module's characteristics and fabrication process. The design concept is that next-generation memory devices will be produced by using current mass-produced memory devices.