DNA-templated copper nanowire fabrication by a two-step process involving electroless metallization
2006; Institute of Electrical and Electronics Engineers; Volume: 5; Issue: 2 Linguagem: Inglês
10.1109/tnano.2006.869691
ISSN1941-0085
Autores Tópico(s)Nanofabrication and Lithography Techniques
ResumoHere, we report a new fabrication method of DNA-templated copper nanowires. The copper nanowires were fabricated via two-step reactions. First, Pd(II) ions were electrostatically adsorbed onto negatively charged DNA molecules immobilized on the substrate surfaces and reduced chemically. As a result, palladium nanowires with a diameter of approximately 6 nm were obtained. Second, the palladium nanowires were dipped into a copper electroless plating bath. Electroless deposition of copper proceeded specifically on the palladium nanowires. The diameters of the copper nanowires were controlled by the plating time
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