Modeling Issues and Performance Analysis of High-Speed Interconnects Based on a Bundle of SWCNT
2010; Institute of Electrical and Electronics Engineers; Volume: 57; Issue: 8 Linguagem: Inglês
10.1109/ted.2010.2050836
ISSN1557-9646
AutoresAlessandro Giustiniani, Vincenzo Tucci, Walter Zamboni,
Tópico(s)Electromagnetic Compatibility and Noise Suppression
ResumoThe effects of the uncertainties associated with the transverse pattern of carbon nanotubes (CNTs) of the conducting type in a semiglobal interconnect based on a densely packed CNT bundle are investigated. The effectiveness of the insertion of a variable number of repeaters along the interconnect and the influence of the contact resistances between CNTs and external circuitry are also studied. The numerical computations are performed by using a multiconductor transmission line model in which the per-unit length parameters are accurately derived from a macroscopic fluidlike description of the conduction phenomena in CNTs.
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