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Microfabrication of large-area circular high-stress silicon nitride membranes for optomechanical applications

2016; American Institute of Physics; Volume: 6; Issue: 6 Linguagem: Inglês

10.1063/1.4953805

2158-3226

Enrico Serra, M. Bawaj, A. Borrielli, Giovanni Di Giuseppe, S. Forte, Nenad Kralj, Nicola Malossi, L. Marconi, F. Marín, Francesco Marino, B. Morana, Riccardo Natali, G. Pandraud, A. Pontin, G. A. Prodi, Massimiliano Rossi, P.M. Sarro, David Vitali, M. Bonaldi,

Advanced MEMS and NEMS Technologies

In view of the integration of membrane resonators with more complex MEMS structures, we developed a general fabrication procedure for circular shape SiNx membranes using Deep Reactive Ion Etching (DRIE). Large area and high-stress SiNx membranes were fabricated and used as optomechanical resonators in a Michelson interferometer, where Q values up to 1.3 × 106 were measured at cryogenic temperatures, and in a Fabry-Pérot cavity, where an optical finesse up to 50000 has been observed.