Effect of Environment on Sn Whisker Growth during Welding of Electronic Wires
2015; Trans Tech Publications; Volume: 1110; Linguagem: Inglês
10.4028/www.scientific.net/amr.1110.235
ISSN1662-8985
AutoresTomomi Sakakida, Tatsuo Kubouchi, Yasuyuki Miyano, Mamoru Takahashi, Osamu KAMIYA,
Tópico(s)Mechanical Behavior of Composites
ResumoIn Pb-free Al-Sn welding of electrolytic parts, single-crystal Sn whiskers easily form and can cause problems such as short circuits. Here we report that the growth of Sn whiskers in the weld zone of Al electrolytic condenser leads was suppressed in a vacuum environment. We examined the effect of the environment and weld metal microstructure in order to understand how to control and prevent whisker growth. In vacuum, the weld zone did not form whiskers after more than 100 h, whereas in air, whiskers grew within several hours. This suggests that whiskers require oxygen to form. The growth can be explained by the energy balance between the potential energy of the weld metal and the surface energy of the whisker. Our results will contribute to developing techniques for suppressing the formation of Sn whiskers during the percussion welding of Al electrolytic capacitor leads.
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