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Thermal Analysis of Compact Electronic Equipment. 2nd Report. Thermal Analysis of Portable Computer with Cooling Fan.

1998; Japan Society Mechanical Engineers; Volume: 64; Issue: 628 Linguagem: Inglês

10.1299/kikaib.64.4179

0387-5016

Katsumi Hisano, Hideo Iwasaki, Masaru Ishizuka, Sadao Makita,

Heat Transfer and Optimization

This paper describes conduction model based numerical simulation technique for portable computers. A numerical analysis was carried out on the basis of thermal conduction treatment for the whole domain of a subnotebook computer which has a cooling fan. In this work, thermal conduction analysis was employed to estimate the temperature distribution of a computer. To treat the airflow caused by the cooling fan, a lump model was used in addition to the thermal conduction model. The numerical model includes silicon chips, LSI packages, printed wiring boards, enclosure, etc., and excludes the liquid crystal display portion. Temperature rise of LSI packages obtained by the numerical analysis showed a good agreement with measured values, and this indicates the effectiveness of the present analysis method for the design of portable computers.