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Photo-Cross-Linking-Assisted Thermal Stability of DNA Origami Structures and Its Application for Higher-Temperature Self-Assembly

2011; American Chemical Society; Volume: 133; Issue: 37 Linguagem: Inglês

10.1021/ja204546h

1943-2984

Arivazhagan Rajendran, Masayuki Endo, Yousuke Katsuda, Kumi Hidaka, Hiroshi Sugiyama,

Bacteriophages and microbial interactions

Heat tolerance of DNA origami structures has been improved about 30 °C by photo-cross-linking of 8-methoxypsoralen. To demonstrate one of its applications, the cross-linked origami were used for higher-temperature self-assembly, which markedly increased the yield of the assembled product when compared to the self-assembly of non-cross-linked origami at lower-temperature. By contrast, at higher-temperature annealing, native non-cross-linked tiles did not self-assemble to yield the desired product; however, they formed a nonspecific broken structure.