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Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization

2011; International Microelectronics Assembly and Packaging Society; Volume: 2011; Issue: HITEN Linguagem: Inglês

10.4071/hiten-paper7-cbuttay

2380-4491

Cyril Buttay, Amandine Masson, Jianfeng Li, C. Mark Johnson, Mihai Lazar, Christophe Raynaud, Hervé Morel,

Intermetallics and Advanced Alloy Properties

Silver sintering is becoming an attractive alternative to soldering, especially for high temperature applications. Indeed, the increase in operating temperature requires new soldering alloys with even higher melting points. Silver sintering, on the contrary, is a solution which only require moderate (<300°C) process temperature. In this paper, we present the implementation of a die attach technique based on sintering of some silver paste, with a special focus on the practical considerations. A good quality bond can be achieved by paying attention to the assembly process.