Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection
2016; Elsevier BV; Volume: 384; Linguagem: Inglês
10.1016/j.apsusc.2016.05.023
ISSN1873-5584
AutoresJunqiang Wang, Qian Wang, Ziyu Liu, Zijian Wu, Jian Cai, Dejun Wang,
Tópico(s)Additive Manufacturing and 3D Printing Technologies
ResumoThe pretreatment with Ar mixed 5% H2 plasma was applied to improve surface properties of electroplated Cu for low temperature Cu-Sn bonding in 3D interconnection. Measurement results revealed that the Ar(5% H2) plasma effectively increased the surface activity by reducing oxygen content of the Cu surface. Lower surface roughness obtained by optimizing the pretreatment condition could help to suppress oxygen adsorption. Relationships between surface energy and surface oxygen content, surface oxygen content and surface roughness were also established. Evaluation of low temperature (200 °C) Cu-Sn bonding with optimal plasma pretreatment exhibited a defect-free interface and high shear strength.
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