Electrochemical Deposition of Ag, Au and Ag-Au Alloys on n-Si(111)
2002; Taylor & Francis; Volume: 80; Issue: 3 Linguagem: Inglês
10.1080/00202967.2002.11871437
ISSN1745-9192
AutoresKevinilo P. Marquez, G. Staikov, J.W. Schultze,
Tópico(s)Molecular Junctions and Nanostructures
ResumoSUMMARYThe mechanisms of silver and gold-silver alloy electrodeposition on n-Si(III) in a cyanide medium have been studied combining electrochemical and surface analytical techniques. The kinetics during the initial stages of deposition were investigated by cyclic voltammetry and chronoamperometry combined with AFM and SEM. The conditions for progressive and instantaneous primary nucleation were elucidated from the analysis of current transients. Based on experimental results a double pulse routine (including a short nucleation pulse to a relatively high cathodic potential E1 followed by a low growth potential E2 was introduced for obtaining continuous and adherent thin metal films. The morphology of deposited films was found to be strongly dependent on the growth potential. The influence of deposition conditions on composition of Ag-Au alloy films was investigated by EDX and XPS. Current-voltage and capacity-voltage measurements showed an ideal Schottky behaviour of the n-Si/Ag, n-Si/Au and n-Si/alloy solid-state contacts, and the formation of high quality junctions in all cases. Specific aspects of metallisation of n-Si/SiO2 microstructure arrays, applying the double pulse polarisation technique, are discussed. The use of the so-called capillary based electrochemical microcellfor localised metallisation on microstructure arrays is demonstrated.
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