SHOCK-INDUCED SPALL IN COPPER: THE EFFECTS OF ANISOTROPY, TEMPERATURE, DEFECTS AND LOADING PULSE
2009; American Institute of Physics; Linguagem: Inglês
10.1063/1.3294971
ISSN1935-0465
AutoresSheng‐Nian Luo, Timothy C. Germann, Qi An, Li-Bo Han, Mark Elert, Michael D. Furnish, William W. Anderson, William G. Proud, William T. Butler,
Tópico(s)Laser-Plasma Interactions and Diagnostics
ResumoShock‐induced spall in Cu is investigated with molecular dynamics simulations. We examine spallation in initially perfect crystals and defective solids with grain boundaries (columnar bicrystals), stacking faults or vacancies, as well as the effect of temperature and loading pulses. Spall in single crystal Cu is anisotropic, and defects and high temperature may reduce the spall strength. Taylor‐wave (triangular or decaying‐shock) loading is explored in comparison with square wave shock loading.
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