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Interfacial Tension between Solid Cu and Liquid Cu-Bi and Cu-Pb Alloys

1993; Japan Institute of Metals and Materials; Volume: 57; Issue: 2 Linguagem: Inglês

10.2320/jinstmet1952.57.2_164

ISSN

1880-6880

Autores

Shigeta Hara, Masashi Hanao, Kazumi Ogino,

Tópico(s)

Engineering and Materials Science Studies

Resumo

The interfacial tension between a liquid Cu-Bi or Cu-Pb alloy and solid Cu was measured by using multiphase equilibria. The results are summarized as follows:(1) The surface tension of solid Cu coexisting with the liquid Cu-Bi or Cu-Pb alloy is significantly lower than that of pure solid Cu, becase Bi or Pb vapor atoms are adsorbed on the surface.(2) The measured interfacial tension, γSL, between the liquid Cu-Bi or Cu-Pb alloy and solid Cu is in fairly good agreement with that calculted by the Good and Girifalco’s equation (γSL=γSV+γLV−2ΦG(γSVγLV)1⁄2), in which the parameter, ΦG, is assumed to be 0.947.

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