Enhanced thermal conductivity of epoxy composites with core‐shell SiC@SiO 2 nanowires
2017; Institution of Engineering and Technology; Volume: 2; Issue: 3 Linguagem: Inglês
10.1049/hve.2017.0041
ISSN2096-9813
AutoresDianyu Shen, Mengjie Wang, Yuming Wu, Zhiduo Liu, Yong Cao, Ting Wang, Xinfeng Wu, Qingtang Shi, Kuan W.A. Chee, Wen Dai, Hua Bai, Dan Dai, Jilei Lyu, Nan Jiang, Cheng‐Te Lin, Jinhong Yu,
Tópico(s)Tribology and Wear Analysis
ResumoElectronic packaging materials and thermal interface materials (TIMs) are widely used in thermal management. In this study, the epoxy composites with core-shell structure SiC@SiO2 nanowires (SiC@SiO2 NWs) as fillers could effectively enhance the thermal conductivity of epoxy composites. The unique structure of fillers results in a high thermal conductivity of epoxy composites, which is attributed to good interfacial compatibility epoxy matrix and bridging connections of SiC@SiO2 NWs. From neat epoxy to 2.5 wt% loading of SiC@SiO2 NWs, the thermal conductivity is significantly increased from 0.218 to 0.391 W m−1 K−1, increased by 79.4%. In addition, the composite with 2.5 wt% filler possess lower coefficient of thermal expansion and better thermal stability than that of neat epoxy. All these outstanding properties imply that epoxy/SiC@SiO2 NWs composites could be the ideal candidate for TIM.
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