Low temperature hermetic laser-assisted glass frit encapsulation of soda-lime glass substrates
2017; Elsevier BV; Volume: 96; Linguagem: Inglês
10.1016/j.optlaseng.2017.04.006
ISSN1873-0302
AutoresSeyedali Emami, Jorge Martins, Luísa Andrade, Joaquim Mendes, Adélio Mendes,
Tópico(s)Solid State Laser Technologies
ResumoRoom temperature and low temperature (120 °C) laser-assisted glass frit bonding of soda-lime glass substrates are accomplished in this work. The locally laser melted bonding showed hermeticity with helium leak rate of <5×10−8 atm cm3 s−1, maintaining its leak rate even after standard climatic cycle tests. Small size devices were bonded at room temperature while larger areas were sealed at the process temperature of 120 °C. The sealing parameters were optimized through response surface methodology that makes the process capable for further development regardless of device size.
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