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Improvement in Thermal Conductivity of Silicon Nitride Ceramics via Microstructural Control and Their Application to Heat Dissipation Substrates

2017; Volume: 64; Issue: 8 Linguagem: Inglês

10.2497/jjspm.64.439

1880-9014

Kiyoshi Hirao, You Zhou, Hiroyuki Miyazaki, Hideki Hyuga,

Semiconductor materials and devices

Silicon nitride is well known as a typical structural ceramic material which exhibits excellent mechanical and heat resistance properties. In addition, β-Si3N4 single crystal is expected to possess a high intrinsic thermal conductivity over 200 Wm−1K−1. This makes silicon nitride a serious candidate as a substrate material for power devices.