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Development of fixed grain micro-saw wire and cutting performance

2017; Elsevier BV; Volume: 13; Linguagem: Inglês

10.1016/j.promfg.2017.09.027

2351-9789

Osamu KAMIYA, Hirosuke Mori, Manabu Ito, Mamoru Takahashi, Y. Miyano, Timotius Pasang, Masanobu Nakatsu, Yuichi Iwama,

Advanced Surface Polishing Techniques

We develop wire saws with the diamond grains bonded to the wires for non-slurry cutting process. We invented a special product machine which has a high vacuum furnace and a special solder that contain a metallic compound. In this paper we demonstrate the finest saw wire that is 50 µm of diameter tungsten (W) wires and can perform in cutting an extremely hard material which include the diamond substrate.