Elastic strain engineering for ultralow mechanical dissipation
2018; American Association for the Advancement of Science; Volume: 360; Issue: 6390 Linguagem: Inglês
10.1126/science.aar6939
ISSN1095-9203
AutoresAmir H. Ghadimi, Sergey A. Fedorov, Nils J. Engelsen, Mohammad J. Bereyhi, Ryan Schilling, Dalziel J. Wilson, Tobias J. Kippenberg,
Tópico(s)Photonic and Optical Devices
ResumoBetter performance under stress Engineering stress or strain into materials can improve their performance. Adding mechanical stress to silicon chips, for instance, produces transistors with enhanced electron mobility. Ghadimi et al. explore the possibility of enhancing the vibrational properties of a micromechanical oscillator by engineering stress within the structure (see the Perspective by Eichler). By careful design of the micromechanical oscillator, and by building in associated stresses, exceptional vibrational properties can be produced. Such enhanced oscillators could be used as exquisite force sensors. Science , this issue p. 764 ; see also p. 706
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