Local Strain Distribution and Microstructure of Grinding-Induced Damage Layers in SiC Wafer
2018; Springer Science+Business Media; Volume: 47; Issue: 11 Linguagem: Inglês
10.1007/s11664-018-6585-y
ISSN1543-186X
AutoresSusumu Tsukimoto, T. Ise, Genta Maruyama, Satoshi Hashimoto, Tsuguo Sakurada, Junji Senzaki, Tomohisa Kato, Kazutoshi Kojima, Hajime Okumura,
Tópico(s)Diamond and Carbon-based Materials Research
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