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Single-Chip 3072-Element-Channel Transceiver/128-Subarray-Channel 2-D Array IC With Analog RX and All-Digital TX Beamformer for Echocardiography

2019; Institute of Electrical and Electronics Engineers; Volume: 54; Issue: 9 Linguagem: Inglês

10.1109/jssc.2019.2921697

1558-173X

Yutaka Igarashi, Shinya Kajiyama, Yusaku Katsube, Takuma Nishimoto, Tatsuo Nakagawa, Yasuyuki Okuma, Yohei Nakamura, Takahide Terada, Taizo Yamawaki, Toru Yazaki, Y. Hayashi, Kazuhiro Amino, Takuya Kaneko, Hiroki Tanaka,

Wireless Power Transfer Systems

This paper presents a single-chip 3072-elementchannel (ECh) transceiver/128-subarray-channel (SCh) 2-D array IC with analog receiver (RX) and all-digital transmitter (TX) beamformer for echocardiography. The proposed IC integrates 3072-ECh transceivers that are composed of a low-power tunable amplitude three-level pulser (TA3LP), zero-power-TX-and-RXisolation switch (ZTRSW), programmable gain-and-inputimpedance low-noise amplifier (PGZLNA), bidirectional dynamically reconfigurable switched-capacitor delayer (BDRSCD), and 24-ECh-to-1-SCh charge-domain adder (CDADD). It also has 128-SCh low-noise cable buffers (LNCBUFs) and all the related peripheral circuits, including control and interface circuits. It has an all-digital TX architecture with a digital beamformer (TX-DBF) that is free from the waveform distortion and timing error caused by long cable propagation between the main instrument unit and the IC. The TA3LP launches the three-level bipolar signals that are necessary for tissue harmonic imaging (THI). The BDR-SCD can delay 2-bit TX digital signals or an RX analog signal; 24 RX signals in an SCh are coherently delayed using BDR-SCDs, summed in the charge domain with a CDADD without signal headroom concerns, and converted into an SCh signal. The proposed IC is fabricated with a 0.18-μm high-voltage silicon-on-insulator (HV SOI) CMOS process. Each ECh transceiver occupies only a 300 μm × 300 μm silicon area while having a greater than 85-dB dynamic range, 25-ns resolution, 750-ns maximum time delay, and 138-Vpp output capabilities. The total die size is 417 mm2. An ultrasound system was also made to visualize 2-D/3-D phantom images with 0.74-mW/ECh power consumption in the B-mode.