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A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects

2020; Institute of Electrical and Electronics Engineers; Volume: 40; Issue: 2 Linguagem: Inglês

10.1109/tcad.2020.2994271

1937-4151

Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao,

Metal and Thin Film Mechanics

Considering temperature gradient or thermomigration (TM) impacts on electromigration (EM) due to Joule heating was less studied in the past. In this article, we propose a new semi-analytical stress transient analysis method to consider both EM and TM effects for general multisegment interconnects. The new method is based on the separation of variables (SOVs) approach to find the analytic solution of coupled EM-TM partial differential equation (PDE). The algorithm consists of several steps. We first develop analytic solutions to compute the steady-state temperature distribution of multisegment wires. Based on this, we derive closed-form solutions for steady-state hydrostatic stress distribution in the context of thermal gradients due to Joule heating for multisegment interconnect wires. With the steady-state stress distribution, the coupled EM-TM PDE can be homogenized and solved by the SOV method. To deal with temperature/position-dependent diffusivity of metal migration process due to nonuniform temperature distribution, we utilize a piecewise linear technique to approximate the position-dependent diffusivity. The numerical results on multisegment interconnects show that the proposed method has negligible error loss compared to commercial finite element analysis software COMSOL but is about an order of magnitude faster than COMSOL with 10× less memory footprint. The numerical results further show that temperature gradient due to Joule heating indeed has significant impacts on the EM failure process.